Embedded computing platforms are designed for specific tasks, so they’re typically much smaller than general‑purpose desktops or laptops. At one end of the embedded computer spectrum, tiny microcontrollers power devices like smart watches. At the other end, industrial embedded computers with rugged processors run full operating systems on compact single board computers, small fanless box PCs, or integrated panel PCs.
Embedded Computing Platform Categories
Single board computers (SBCs)
An SBC integrates the processor, memory, storage, power management, and input/output (I/O) connectors on a single board or small board stack. An SBC has the advantage of being customizable exactly to the device or application – very efficient for production and component cost.
Computer-on-modules (COMs) on carriers
A COM includes the processor, memory, and essential components, while the carrier board (or baseboard) provides power management and I/O. A related term, SOM (system-on-module), typically uses a microprocessor or microcontroller, compared to a COM’s higher-end processors and operating systems.
This split architecture enables the carrier to be customized to the exact I/O requirements of the application, while the COM can be upgraded over time, an advantage often described as “future proofing” the embedded computer. When paired, a COM and carrier deliver the functional equivalent of an SBC.
Industrial PCs
Industrial computers, also known as box PCs and industrial systems, package ruggedized SBCs or COM‑and‑carrier stacks inside a durable enclosure with flexible mounting options.
They support expansion features, offer accessible I/O similar to commercial computers, and often use the enclosure itself for thermal dissipation in fanless designs. Some models include ingress protection for harsh environments. Because they arrive as complete systems, industrial PCs can be faster and simpler to deploy than board‑level solutions.
Panel PCs
Panel PCs combine an embedded SBC with a touch‑screen display to create a self‑contained HMI (human‑machine interface). They’re widely used in industrial control, kiosks, and digital signage. Screen size, display quality, and touch technology must align with the application environment. Ingress protection can be built into the panel PC or provided by the equipment it’s mounted into.
Impact of Increasing SWaP Requirements on Embedded Computers
Advances in component technology continue to push improvements in SWaP – size, weight, and power. As processors (CPUs, GPUs, and SoCs) evolve from handling gigabytes to teraflops of data, designers must balance performance with power efficiency and thermal management.
Many embedded systems use fanless cooling, relying on heat spreaders and heatsinks to dissipate heat through conduction. Fanless designs improve reliability, reduce maintenance, and perform well in harsh environments. Active cooling—via fans or liquid‑cooling loops—may still be necessary for higher‑performance processors that generate more heat in compact spaces. As processing demands grow, more creative thermal solutions are becoming common.
At 91, we work closely with customers to configure our COTS embedded computer platforms to meet the exact needs of their applications.
Learn more